The summer of 2019 I was accepted to a Research Experience for Undergraduates (REU) at the University of Arkansas. REU's are NSF funded research programs where undergrad students can gain exposure to PhD level research. At the University of Arkansas I performed research to try and optimize digital twin systems using hardware in the loop (HIL).
I primarily worked with transistors in basic circuits with the goal to "predict" or model in real time the die temperature of the circuits. To verify my results I compared three different thermal measurement methods including Solidworks thermal simulation, HIL, and physical testing with thermal imaging.
After completing the research over the course of the summer my poster was accepted to the IMECE 2019 conference where I presented. My poster and summary of the results can be seen below.
